Soldering processes and equipment 1993 06 04 unknown on amazoncom free shipping on qualifying offers. Soldering processes and equipment michael pecht on amazoncom free shipping on qualifying offers addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards demonstrates how to control contamination during cleaning procedures covers material dynamics of heat soldering incurred during . The new 868 series connectors include solder cups to accommodate wire and cable attachment along with flanged insulators and fastening options they are ideal for mounting into product housings for docking stations cable terminations heavy duty quick connects and panel mount equipment. The method of solder leveling comprising maintaining a zone of hot saturated inert vapor at substantially the temperature of molten solder above a molten bath of solder moving the part to be treated through the vapor at a rate such that it will become uniformly heated to substantially the temperature of the molten solder prior to immersion therein immersing the part in the molten solder
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